This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., "smaller, better, cheaper" their influence on the manufacturing processes. Topics include area packaging- ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as is emerging technologies namely, 3-D and stacked die, and packaging reliability issues. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.

This course provides attendees with an overview of the fundamentals, current status, and technical challenges of EUV Lithography. The course will begin with a review of lithography in general drawing parallels between EUV and DUV lithography. The course will then go on to review EUV specific challenges/solutions including sources (lithography and metrology), optics, metrology, masks, and patterning materials. Two areas where EUV specific challenges are particularly significant are patterning materials and photomasks; this course will cover these two areas in more detail including topics such as resist stochastics, radiation chemistry, reflective thick masks, off-axis mask illumination, phase shift masks, and mask stochastics. 


This course is intended for anyone who is involved or interested in the development of EUV Lithography, needs to understand the core technologies related to EUV Lithography, or is interested in learning the fundamentals of this leading patterning technology. The course provides a general overview, and even deeper topics of resist and masks will also be kept at the generalist level- making the course accessible to a broad technical audience.

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.



The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). This course provides a practical introduction to Atomic Layer Deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing as it relates to ALD and ALE are heavily discussed. Professionals in the semiconductor industry that want to understand ALD technology and chemistry used in ALD and ALE are highly encouraged to attend. This course may especially benefit those who are directly working with precursor gases used in ALD and ALE processing, including gas and equipment providers.

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field.


The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed.


Topics covered:

-Fluorocarbon plasma etching of Si and its compounds

-Selectivity, loading effects, and aspect ratio dependent etching

-Uniformity of etching, damage, feature charging issues, and particles

-Etching of other materials (Al, organics, III-V compounds, etc)

-Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence

-Issues in high density plasma etching, wall effects, and ion beam-based methods

-Deep Reactive Ion Etching (DRIE)

-Applications and processing etching using ALE

-End point detection

This course provides an overview of Airborne Molecular Contamination (AMC) in a cleanroom and how it can affect the cleanliness of critical chamber components. The curriculum covers the fundamentals of cleanroom design and includes practical case studies on working in a cleanroom, monitoring and characterizing AMC, conducting risk assessments, and developing troubleshooting test plans. Additionally, the course demonstrates how to resolve contamination escalations of critical chamber components using the SEMI Auxiliary document, “Microcontamination in Semiconductor Process Equipment.”

Learning Objectives:

• Cleanroom Fundamentals: Reviewing design, material selection, and best practices to control AMC.
• Monitoring and Analysis: Discussing off-line, on-line, and in-line methods for AMC monitoring.
• Analytical Techniques: Providing a comprehensive summary of techniques used to identify AMC on critical chamber components.
• Audits and Assessments: Describing how to perform a cleanroom contamination audit and a contamination risk assessment.
• SEMI Standards Application: Applying the SEMI Auxiliary Document, “Microcontamination in Semiconductor Process Equipment: Guide to monitoring contamination sources that may affect the cleanliness of critical chamber components,” to analyze defects and their contributing sources.

2.5D and 3D packaging are a natural outgrowth of hybrid and multi-chip packaging technologies which have developed to enable autonomous vehicles, Internet of Things (IoT), and Data Center/Cloud Computing/AI applications. Newly developed processes such as high-density interconnect substrates, Through Silicon Vias (TSVs), Chip on Wafer (CoW), Wafer-on-Wafer (WoW), integrated passives, and embedded antennas have made the promises of heterogeneous packaging, or System-in-a-Package (SiP), a reality. With heterogeneous packaging, die with the best processes for a given functionality can be selected and integrated into a single system-in-a-package or module. For example, mixing analog and digital functions on a single die often results in performance compromises. However, these complex manufacturing flows, coupled with today’s focus on chiplets (building blocks that are in their own right, extremely complex), creates significant challenges for test, fault isolation, and yield improvement.

This is an 8-hour in-person course that offers an in-depth look into today’s advanced packages, the test strategies, and the methods for analyzing these products. We will place special emphasis on the issues related to manufacturing, testing, and analyzing these next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.

Topics covered:

1. Current 2.5D/3D Packaging & Technologies
2. Testing Current 2.5D/3D Packaged Products
3. Performing Fault Isolation & Failure Analysis on 2/5D/3D Packaged Products
4. Yield Improvement Challenges & Strategies

Course Objectives

1. Participants will gain a better understanding of the taxonomy and terminology associated with 2.5D and 3D packages.
2. Review the fabrication techniques, methods, and assembly flows to create a variety of options that are now available for these packages.
3. Provide a working knowledge of high-density interconnect production techniques, performance, and trade-offs.

 

The goal of this course is that the students of all levels come away with an understanding of the issues involved in transmitting RF energy to be used in creating plasmas in semiconductor manufacturing tools. This fluency in discussing RF power delivery and plasma issues and being able to effectively discuss the real issues with RF power delivery to plasma will help focus on applying the correct solutions to many common issues and assist in supporting plasma-based customers.

Students will be taught what a plasma is and does, what it is used for, and how it is used to deposit and etch thin films that are used in the semiconductor industry. We will teach how RF energy is used to create plasma, and how RF power is generated and transmitted through system components and into the plasma chamber.

A discussion will be held on how RF parameters and resulting plasma parameters can influence the outcomes of etch, CVD, and PVD processes. Further, we’ll discuss how the RF delivery components can influence the plasma properties that determine process results, on proper grounding and shielding, and on how to troubleshoot common RF problems.

We’ll show some RF instrumentation that can be used in the field to determine system state and to troubleshoot problems.
This course will be mostly lectures and a short hands-on demo lab, which will draw a few volunteers from the class to show RF matching, plasma measurements, and some illustrations and effects in a self-contained benchtop plasma generation system.

This introductory course is designed to educate people from any background that are new to Microsystems Fabrication and Applications, no prior knowledge is expected. We begin with some historical applications to set the stage for diving into how these devices are made. We will go through the fabrication of a simple sensor and actuator device describing fabrication and characterization methods used in training students and participants new to the field.

Topics Covered

Introduction and Context

• Background and Introduction
• Historical evolution of MEMS from IC technology
• Key industry applications (automotive, biomedical, aerospace, IoT)
• Market trends and microsystems workforce needs

MEMS Devices and Applications

• Overview of common MEMS devices (sensors, actuators, DMD, Inkjet)
• Examples from research and education including CAD designs

Photolithography for MEMS

• Fundamentals of resist processing and alignment
• Resist types and their role in MEMS
• Common photolithography issues and solutions

Etching Techniques

• Wet etching: isotropic and anisotropic (e.g., KOH, HF)
• Dry etching: RIE, DRIE
• Process selectivity, stiction, and release strategies – XeF2, HF Vapor

Thin Film Deposition

• Overview of PVD, CVD, and ALD methods
• Common materials for MEMS (metals, oxides, nitrides)
• Deposition challenges and effects on device performance

Metrology and Characterization

• Techniques: profilometry, SEM, optical inspection
• Measuring film thickness, CD, roughness, and alignment
• Use of metrology in process monitoring and SPC
• Wafer level testing

Packaging

• MEMS packaging examples

Learning Objectives

• Identify and describe common MEMS devices, including sensors, actuators, and display technologies like DMD and inkjet systems
• Understand the principles of photolithography
• Compare etching and release techniques (wet vs. dry) and explain their roles in defining microscale features, including release strategies using XeF₂ and HF vapor
• Describe thin film deposition methods
• Use knowledge of metrology tools and techniques to evaluate film thickness, critical dimensions (CD), roughness, and device alignment
• Discuss process monitoring and control using metrology data in the context of statistical process control (SPC)
• Summarize key MEMS packaging strategies, including wafer bonding and die-level considerations
• Appreciate educational and workforce training models, including hands-on cleanroom experience, NSF-funded initiatives, and academic-industry partnerships

Who Should Attend

People from any background that are new to Microsystems Fabrication and Applications. No prior knowledge is expected.

Per- and Polyfluoroalkyl substances (PFAS) are a group of over 15,000 compounds which have been used in a variety of different industries due to their unique properties. Over the past two decades, their presence in water and the human body has become of increasing concern, with studies linking certain PFAS to adverse effects in the organisms studied. This has led to increasing consumer awareness, litigation, and the regulation of PFAS compounds. This course provides an in-depth review of PFAS compounds, their history, market drivers, regulations, current uses in the semiconductor industry, and methods for sampling and analysis, over the entire semiconductor value chain.


Course Outline:

- Introduction to PFAS Compounds

- Current uses of PFAS in the Semiconductor Environment

- PFAS Value Chain in the Semiconductor Industry

- Market Drivers for PFAS in the Semiconductor Value Chain

- Sampling and Analysis of PFAS in the Semiconductor Value Chain

- Case studies

- Q&A and Wrap up

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Course tropics include:

- Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits

- Process Nodes: Process nodes and their impact on device performance and cost-

- Device Physics and Transistor Operation: Principles of device operation and transistor functionality

- Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes

- Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance

- Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools

- Wafer Processing:

-Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)

-Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues

-Etching and Cleaning Processes: Plasma and wet etching processes

-Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication

-Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance-

-Electroplating and Sputtering: Metal deposition techniques used in manufacturing

-Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes

-Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing

-Semiconductor Industry Ecosystem: The major players in the industry