This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., "smaller, better, cheaper" their influence on the manufacturing processes. Topics include area packaging- ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as is emerging technologies namely, 3-D and stacked die, and packaging reliability issues. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.

This course provides attendees with an overview of the fundamentals, current status, and technical challenges of EUV Lithography. The course will begin with a review of lithography in general drawing parallels between EUV and DUV lithography. The course will then go on to review EUV specific challenges/solutions including sources (lithography and metrology), optics, metrology, masks, and patterning materials. Two areas where EUV specific challenges are particularly significant are patterning materials and photomasks; this course will cover these two areas in more detail including topics such as resist stochastics, radiation chemistry, reflective thick masks, off-axis mask illumination, phase shift masks, and mask stochastics. 


This course is intended for anyone who is involved or interested in the development of EUV Lithography, needs to understand the core technologies related to EUV Lithography, or is interested in learning the fundamentals of this leading patterning technology. The course provides a general overview, and even deeper topics of resist and masks will also be kept at the generalist level- making the course accessible to a broad technical audience.

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.



The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). This course provides a practical introduction to Atomic Layer Deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing as it relates to ALD and ALE are heavily discussed. Professionals in the semiconductor industry that want to understand ALD technology and chemistry used in ALD and ALE are highly encouraged to attend. This course may especially benefit those who are directly working with precursor gases used in ALD and ALE processing, including gas and equipment providers.

Per- and Polyfluoroalkyl substances (PFAS) are a group of over 15,000 compounds which have been used in a variety of different industries due to their unique properties. Over the past two decades, their presence in water and the human body has become of increasing concern, with studies linking certain PFAS to adverse effects in the organisms studied. This has led to increasing consumer awareness, litigation, and the regulation of PFAS compounds. This course provides an in-depth review of PFAS compounds, their history, market drivers, regulations, current uses in the semiconductor industry, and methods for sampling and analysis, over the entire semiconductor value chain.


Course Outline:

- Introduction to PFAS Compounds

- Current uses of PFAS in the Semiconductor Environment

- PFAS Value Chain in the Semiconductor Industry

- Market Drivers for PFAS in the Semiconductor Value Chain

- Sampling and Analysis of PFAS in the Semiconductor Value Chain

- Case studies

- Q&A and Wrap up

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Course tropics include:

- Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits

- Process Nodes: Process nodes and their impact on device performance and cost-

- Device Physics and Transistor Operation: Principles of device operation and transistor functionality

- Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes

- Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance

- Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools

- Wafer Processing:

-Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)

-Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues

-Etching and Cleaning Processes: Plasma and wet etching processes

-Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication

-Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance-

-Electroplating and Sputtering: Metal deposition techniques used in manufacturing

-Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes

-Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing

-Semiconductor Industry Ecosystem: The major players in the industry