Students will learn to breadboard and troubleshoot basic electronics circuits during the class with multimeters.

This course introduces basic electronic concepts such as current, voltage, resistors, capacitors, inductors, diodes, and transistor fundamentals. Essentially, this course covers all that you need to know to get started in the electronics and semiconductor industry.

Learning Objectives:

• Summarize fundamental concepts about electronics
• Describe foundational electronic terms and their definitions
• Read data sheets and schematics for electronic components

This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip, as is emerging technologies namely, 3-D and stacked die, and packaging reliability issues. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.

Attendees will have access to handle various semiconductor items during the presentation such as: Photomask, Reticles, Wafers, Poly Silicon, etc.

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.

The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

This course, about the device yield-related aspects of the Silicon Wafer is designed to give engineers working in yield improvement, as well as all process engineers and others who are involved in specifying Silicon in IC and MEMS devices, a working knowledge of the defects associated with the Silicon that arise from the vendor as well as those generated through device processing.

Throughout the course, practical knowledge of specific silicon defect and yield-related manufacturing examples will be introduced through a series of Short, one page "Applications Notes" covering topics of interest. A method to distinguish between bulk and surface stacking faults, methods to add gettering to SOI wafers, how to reduce high temperature leakage currents through the use of EPI In MEMS processing, and improved dimension control through the use of SOI wafers will also be discussed during this training.

All personnel who want to gain a fundamental understanding of how the Silicon wafer impacts device process yields, including: Yield Improvement Engineers, Process Engineers, Quality Engineers involved with Silicon, and Supply Chain Management are encouraged to complete this training.

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources.

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed.