Instructor:  Paul Hoffman – President, Sapient Focus

This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” their influence on the manufacturing processes. Topics include area packaging- ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies – chip & wire, tape automated bonding, and flip chip, as is emerging technologies namely, 3-D and stacked die, and packaging reliability issues. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.

Learning Objectives:

• Identify the wide variety of package types and how they align with different application uses.
• Understand chip interconnection technologies (such as wirebond, flip chip or thin film) and chip encapsulation.
• Identify the materials and processes used in packaging.
• Summarize the current state of the art packages.
• Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.

Instructor:  Charles Winter, PhD – Wayne State University, Department of Chemistry

Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). This course provides a practical introduction to Atomic Layer Deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing as it relates to ALD and ALE are heavily discussed. Professionals in the semiconductor industry that want to understand ALD technology and chemistry used in ALD and ALE are highly encouraged to attend. This course may especially benefit those who are directly working with precursor gases used in ALD and ALE processing, including gas and equipment providers.

Learning Objectives:

• Understand foundational concepts of ALD.
• Describe chemical precursors for use in ALD.
• Identify selected SLD processes and their associated films and materials.
• Explain area-selective deposition (ASD) and its uses.
• Describe Atomic Layer Etching (ALE) concepts and understand its relationship to ALD.

Instructor: Dr. Patrick Naulleau

This course provides attendees with an overview of the fundamentals, current status, and technical challenges of EUV Lithography. The course will begin with a review of lithography in general drawing parallels between EUV and DUV lithography. The course will then go on to review EUV specific challenges/solutions including sources (lithography and metrology), optics, metrology, masks, and patterning materials. Two areas where EUV specific challenges are particularly significant are patterning materials and photomasks; this course will cover these two areas in more detail including topics such as resist stochastics, radiation chemistry, reflective thick masks, off-axis mask illumination, phase shift masks, and mask stochastics. 

This course is intended for anyone who is involved or interested in the development of EUV Lithography, needs to understand the core technologies related to EUV Lithography, or is interested in learning the fundamentals of this leading patterning technology. The course provides a general overview, and even deeper topics of resist and masks will also be kept at the generalist level- making the course accessible to a broad technical audience.

Learning Objectives:

• Understand foundational concepts of EUV Lithography.
• Explain the basics of EUV source brightness and implications on lithography and metrology.
• Describe the fundamentals of EUV multilayer optics and patterning.
• Identify the key components in EUV system.
• Describe EUV resist materials and stochastics.

Instructor:  Richard Beaudry

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field.

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed.

Topics covered:
- Fluorocarbon plasma etching of Si and its compounds
- Selectivity, loading effects, and aspect ratio dependent etching
- Uniformity of etching, damage, feature charging issues, and particles
- Etching of other materials (Al, organics, III-V compounds, etc)
- Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence
- Issues in high density plasma etching, wall effects, and ion beam-based methods
- Deep Reactive Ion Etching (DRIE)
- Applications and processing etching using ALE
- End point detection

Learning Objectives:

• Understand the fundamentals of dry etching and the basic concepts of plasma etching.
• Understand the physics of rf glow discharges (both high and low density).
• Understand the surface science aspects of RIE including the role of energetic ions.
• Recognize the which influence etching anisotropy.
• Define the steps of plasma-surface chemistry leading to etching.

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in. The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Instructor:  Eve Kroukamp, Dr.

Per- and Polyfluoroalkyl substances (PFAS) are a group of over 15,000 compounds which have been used in a variety of different industries due to their unique properties. Over the past two decades, their presence in water and the human body has become of increasing concern, with studies linking certain PFAS to adverse effects in the organisms studied. This has led to increasing consumer awareness, litigation, and the regulation of PFAS compounds. This course provides an in-depth review of PFAS compounds, their history, market drivers, regulations, current uses in the semiconductor industry, and methods for sampling and analysis, over the entire semiconductor value chain.

Course Outline:
- Introduction to PFAS Compounds
- Current uses of PFAS in the Semiconductor Environment
- PFAS Value Chain in the Semiconductor Industry
- Market Drivers for PFAS in the Semiconductor Value Chain
- Sampling and Analysis of PFAS in the Semiconductor Value Chain
- Case studies
- Q&A and Wrap up

Learning Objectives:

• Understand the chemical properties and historical development of PFAS.
• Identify market drivers and regulatory impacts on PFAS usage in the semiconductor industry.
• Learn about current applications and challenges of PFAS in semiconductor manufacturing.
• Gain knowledge of sampling and analytical methods for PFAS.
• Explore the entire PFAS value chain, including influent, effluent, solid wastes, recycling, and recyclability.

Instructor:  Victor K.F. Chia, Ph.D.

This course is designed for people who utilize cleanrooms. Semiconductor device manufacturing is a complex process that involves working in a cleanroom with a wide range of specialized equipment and materials. Many challenges must be overcome to meet production goals. This course provides the fundamentals and thought processes to improve your production reliability and yield. This course is intended for mechanical engineers, process engineers, test engineers, quality assurance engineers, and technicians.

This course is divided into four learning modules.

Module 1: AMC and SMC in the Cleanroom Module 2: Contamination Troubleshooting for Root Source Identification Module 3: Process Tool Parts Cleanliness and Testing Module 4: Best Practices for Clean Manufacturing

Module 1 provides a basic understanding of contamination in a cleanroom, such as airborne molecular contamination (AMC) and surface molecular contamination (SMC). AMC in the cleanroom is introduced by cleanroom construction materials, people, and process materials. Therefore, AMC is constantly present in a cleanroom and must be controlled. If unmanaged, AMC leads to SMC on critical parts that can be introduced into the chamber and cause wafer defects. Identification and mitigation strategies will be discussed.

Module 2 reviews analytical techniques for quality control and failure analysis. Monitoring contaminants and defects is necessary throughout the production life cycle. In the event of a contamination escalation, using the appropriate technique allows for a rapid resolution which reduces production downtime for improved profitability. We will discuss the capabilities of these techniques and provide a decision guide to identify contamination and defects on parts and wafers.

Module 3 focuses on parts cleanliness testing. Process tool parts shall be verified to be clean before installing it into the tool and to ensure they meet the cleanliness specifications required for the technology process node. Parts that fail the cleanliness specification should undergo Root Cause Analysis (RCA) to understand the underlying causes of the process tool part failures. An overview of the SEMI Component, Instrument and Subsystem (SCIS) idea for standardization approach for Parts Cleanliness Testing will be discussed.

Module 4 presents Best Practices for cleanroom operations to optimize Clean Manufacturing. Diligent adherence to these practices is important because product quality requires minimal variability during process activities, whether it is in a fab, OEM (Original Equipment Manufacturer) plant, supplier site, or at a cleaning vendor. Regular testing and audits ensure Best Practices are followed and Standard Operating Procedures (SOPs) may be revised based on the analytical data. Together with continuous improvement programs and lean principles, these Best Practices can lead to long-term resilient operations.

Learning Objectives:

• Understand contamination can happen in a cleanroom, including airborne molecular contamination (AMC) and surface molecular contamination (SMC).
• Describe analytical techniques for quality control and to perform the appropriate failure analysis for various types of contamination situations.
• Qualify the cleanliness of process tool parts against industry standards.
• Explain the best practices for cleanroom operations to optimize clean manufacturing

Instructor: Denny Frye, PT International

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.
Course tropics include:
- Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
- Process Nodes: Process nodes and their impact on device performance and cost-
- Device Physics and Transistor Operation: Principles of device operation and transistor functionality
- Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
- Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
- Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
- Wafer Processing:
- Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
- Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
- Etching and Cleaning Processes: Plasma and wet etching processes
- Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
- Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance-
- Electroplating and Sputtering: Metal deposition techniques used in manufacturing
- Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
- Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
- Semiconductor Industry Ecosystem: The major players in the industry

Learning Objectives:

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals